产品介绍

PRODUCT INTRODUCTION

Fully automatic inline tin-removal/reballing/soldering equipment, suitable for repairing defective products in the semiconductor chip packaging process, using a single-point laser reballing and soldering system, human-machine control, intelligent motion system, can store multiple sets of product formula programs, simple line change and fast standard SMT runner-type loading and unloading, adjustable ESD synchronous belt components can be connected to other process equipment at the front and end of the production line, with strong overall compatibility, compatible with BGA industry standard trays.

产品特点

PRODUCT FEATURES

Non-contact single-point desoldering

Employing a non-contact single-point desoldering head, and aided by a high-precision laser displacement sensor for height measurement and a precision gravity sensor, it can effectively remove solder from a single point, effectively addressing single-point defects in products.
Single-point ball placement and laser welding system

Four independent dip needles transfer the flux from the flux system to the pads where solder balls need to be placed, and four independent nozzles place the solder balls onto the pads, followed by laser soldering and curing.
Three CCD vision systems

Equipped with three CCD vision systems and independently developed control software, it can detect materials in the acupoints on the tray and accurately load and unload materials. AOI can detect and accurately locate defects on the product, and the ball-planting nozzle can be automatically calibrated after line change.
Four independent preheating platforms

It is equipped with four independent preheating platforms, each with a heating and temperature control system. BGA desoldering and ball placement are performed on these platforms. Both the preheating platforms and the desoldering heads use closed-loop temperature control, ensuring stable and accurate overall temperature control.

产品参数

SPECIFICATION

型号	ASE2500L
Equipment Specifications	Total power	5KW
	Compatible BGA chip size	27x27mm (Max); 3x3mm(min)
	Tray size	323x136x8mm (standard industry tray)
	Preheating table temperature	≤200°C (adjustable)
	Solder head heater temperature	≤600°C (adjustable)
	Tin residue	≤15%
	Desoldering nozzle	Φ0.2-Φ1 is replaceable
	Tin ball size	0.2-0.76mm
	Ball planting accuracy	Deviation < 1/3 of the ball diameter
	Ball-planting suction nozzle	Φ0.15-Φ0.6 replaceable
	Production yield	Yield rate over 95%
	Line change time	30min
	Replace the ball-planting nozzle for calibration	CCD+ Tool Setting Instrument Sensor Calibration
	Dimensions	L1420xW1280xH1850mm
	Weight	1200KG

产品详情

Product Details

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